| 摘要 |
<p>PURPOSE:To increase the adhesive strength of a land by forming a dummy via hole regardless to a circuit just under the land, to which an electronic part is connected, and connecting the dummy via hole to the land. CONSTITUTION:A plurality of base materials are laminated and contact-bonded and baked, and conductive paste as the conductor pattern 2 of a surface layer is screen-printed and baked again, thus forming a multilayer ceramic circuit board. The conductor patter 2 bonded with the land 3 and the conductor pattern 5 of an internal layer must be connected positively on a circuit, and a conductive-connected via hole 6 is shaped. The via hole may not necessarily be bonded with the circuit just under the land 3. When the conductive-connected via hole 6 is not formed just under the land 3, a dummy via hole 7 regardless to the circuit is shaped just under the land 3 and bonded with the land 3 in order to increase the adhesive strength of the land.</p> |
