| 摘要 |
In the clamping device according to the invention, a cooling body (1) is provided with a planar face (1a, 1b), against which the wafer-shaped semiconductor components (4) bear. A pressure-applying body (5) made of elastic material bears on the semiconductor components (4). The pressure-applying body (5) is clamped against the cooling body (1) by means of a tensioning element (6). In order to facilitate fitting and maintenance of the semiconductor components, the tensioning element (6) is shaped like a plate and is attached to the cooling body (1) by means of a hinge joint (7). <IMAGE> |
