| 摘要 |
PURPOSE:To eliminate a manual soldering step from the manufacturing process of a printed wiring board so as to simplify the manufacturing process by forming required circuits of jumper circuits, etc., by printing simultaneously with the formation of a shield layer formed by silk printing with conductive ink. CONSTITUTION:A shield layer 4 is formed by similarly coating the entire or partial surface of an insulating layer with conductive ink of copper paste, etc., by silk printing, etc. Simultaneously with the formation of the layer 4, jumper circuits 5 which connect required terminals 6 with each other are formed by using the conductive ink. Therefore, the degree of freedom in designing circuits can be increased and the manufacturing process of a printed wiring board can be simplified, since the separate step of manual soldering can be eliminated and, at the same time, the relatively long jumper circuits can be formed accurately. |
