| 摘要 |
A multifunctional card includes a substrate having a semiconductor circuit, and a housing, made of an insulating material, for housing the substrate. The housing comprises two pieces of housing halves to be fitted to contain the substrate therein. In the housing, a sheet-like member constituted by metal and insulating layers put on one another is positioned between the substrate and the housing to cover at least central portion of the substrate with the insulating layer inside. The metal layer is electrically connected to ground portions of the substrate, the ground portions of the substrate being formed so as to contact with a ground portion of a main apparatus. |
