发明名称 APPEARANCE INSPECTION DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To attain an appearance inspection with satisfactory accuracy without changing the resolution of a camera by giving the appearance inspection device composition in which an IC having a gull-wing-type leads is mounted on a mirror, illuminated from an 45 deg. direction, and image-picked up. CONSTITUTION:A light beam 3c emitted from an illuminator 3 is made into a light beam which is reflected on a lead tip surface 1a of an IC 1, reflected on a mirror 2 as an inspection base and returned, and another light beam which is reflected on the mirror 2, reflected on the lead tip surface 1a and returned, and when a camera 4 image picks up these light beams, the camera 4 image picks up the real image of the lead tip surface 1a and the mirror reflected image in the same brightness and sends the converted outputs to a picture processing inspection device 5 as video signals. Thus, in the picture processing inspection device 5, since a result obtained by multiplying the clearance between the lead tip surface 1a and the mirror 2 by sq. rt. 2 is to be measured by measuring and deciding a clearance alpha between the real image of the lead tip surface 1a and the mirror reflected image inspection accuracy can be improved by using the same camera 4 as that in a conventional case.
申请公布号 JPH02155083(A) 申请公布日期 1990.06.14
申请号 JP19880310317 申请日期 1988.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORINAGA KAZUNORI
分类号 G01B11/14;G01N21/88;G01N21/956;G06T1/00;H01L21/66 主分类号 G01B11/14
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