| 摘要 |
<p>PURPOSE:To prevent the electrostatic breakdown of a device and to dispense with cleaning after dicing by providing a conductive brush in contact with the surface of a wafer in the vicinity of a rotary blade. CONSTITUTION:The conductive brush 11 connected to the earth and provided under a nozzle 4 is in contact with the surface of a disc blade 3 rotating at a high speed and the semiconductor wafer on a stage 1 at the leading end thereof and operated in connection with the blade 3. Therefore, the static electricity generated in the cooling water injected from the nozzle 4 at the time of dicing and the chips of the semiconductor wafer 2 can be removed by the conductive brush and the chips generated on the surface of the semiconductor wafer 2 at the time of dicing can be also removed by the conductive brush 11.</p> |
