| 摘要 |
PURPOSE:To attain wire bonding at ultra-high speed while realizing bonding having high reliability by successively detecting the height of interfaces on bonding and controlling the operation of a head. CONSTITUTION:When a capillary is landed at the interface of a pad and an underside detector 1 is operated, the content of a register 4 is updated to the current height of the pad, and sequence is started according to a variable position using the latest landing height as a reference in subsequent sequence. When a bonding tool leads out a wire and reaches the maximum of starting, the underside-position register 4 is changed over to a register on the load side, and preceding held lead height is employed as a reference. Sequence is started, and the bonding tool is lowered toward a second interface (a lead). When the capillary is landed to the lead, the content of the underside-position register 4 is updated to lead-landing height. Subsequent sequence is started using the latest lead landing height as the reference. |
