| 摘要 |
PURPOSE:To realize a power module in which a lid of electrode terminal screw- down type is not used by a method wherein an electrode element for main current and an electrode terminal for signal are insert-molded on a resin case beforehand, and these are soldered, with cream solder, a plurality of electrode plates on an insulation board when these are joined to a metal base plate. CONSTITUTION:An insulation board 7A with thick copper foils is carried on a metal base plate 6. A semiconductor chip 1, a flywheel diode chip 5, and a speed-up diode chip 3 are simultaneously soldered thereon, then bonded by means of an aluminum wire 14. In addition, a resin case in which electrode terminals for main current 8 to 10 and a terminal 21 for external signals are integrally insert-molded is provided. In putting this resin case 16 on the metal base plate 6 and bonding, a plurality of electrode terminals 8, 9, 10, 21 on the resin case 15 side are soldered on a plurality of electrode plates on the metal plate 6 side by using cream solder. As a result, a screw-down type semiconductor device which does not require the mounting of a lid can be fabricated.
|
