MONITORING ELECTROLESS PLATING

摘要

Apparatus and method for determining the initiation, progression and quality electroless plating of blind or through hole walls in circuit panels. A test coupon for monitoring plating is provided having a sensitized initiation conductivity zone and sensitized through-hole walls arranged in a series resistance circuit with both conductivity zone and series circuit being measured periodically as to resistivity to determine the start or "take" of electroless plating and its progress during continued immersion.