发明名称 FLAT COIL MOUNTING METHOD
摘要 <p>PURPOSE:To conduct a reliable connection by a method wherein, when a flat coil is mounted on a circuit substrate which is used on a motor, a transformer and the like, a terminal part consisting of a solder layer is formed in the widthwise direction of the starting end and the terminal of the coil, a solder layer is also provided on the conductive pattern of the circuit substrate, and the connecting work is conducted using the solder layers. CONSTITUTION:A flat coil 1 is formed by windingly laminating a copper foil in the thickness with which desired characteristics will be obtained, and terminals 3 and 4, consisting of a solder layer on their starting end and the finishing end of winding, are integrally formed on the whole width of the coil in the direction of width (t). At this point, between each copper foil 2 is completely insulated. Then, when the above-mentioned coil 1 is connected to the circuit substrate 41 having a conductive pattern 42, a bonding agent 44 for temporary fixing is provided at the arranging position of the coil 1 on the substrate 41, and also the connection parts of the terminals 3 and 4 of the coil 1 are coated with solder 45 mixed with paste. Subsequently, the above-mentioned material is placed in a heating furnace, the solder 45 is raised up, connected to the pattern 42, and at the same time, the solder 45 is welded allover the width of the terminals 3 and 4.</p>
申请公布号 JPH02153502(A) 申请公布日期 1990.06.13
申请号 JP19880307535 申请日期 1988.12.05
申请人 SONY CHEM CORP 发明人 HIGUCHI SHIGETAKA;NOGUCHI ISAO;ODAJIMA TORU
分类号 H01F5/00;B23K35/02;H05K1/18;H05K3/30;H05K3/34 主分类号 H01F5/00
代理机构 代理人
主权项
地址