| 摘要 |
<p>PURPOSE:To enable vertical machining of a wafer to be made accurately and easily by rolling the wafer along a curved edge and utilizing the movement proper to the wafer. CONSTITUTION:A wafer 1 rotates along the curved edge and enters wafer edge guides 7 and 8 of a wafer-retainer 3. Then, the wafer 1 within the wafer edge guides 7 and 8 stops when it is located directly below an orientation flat 1a. The wafer retainer 3 which retains the wafer 1 within the wafer edge guides 7 and 8 moves toward a wafer edge sensor 5 and stops at a position where the edge of the wafer 1 is detected by a wafer edge sensor 4. As soon as the wafer retainer 3 stops, a spin chuck 5 is extended toward the rear surface of the wafer 1 and performs vacuum suction of the wafer 1. Then, while retaining the wafer 1, the spin chuck 5 returns to its original position and performs a specified machining of the wafer 1. Thus, handling and alignment of an accurate and easy vertical type wafer can be performed.</p> |
