| 摘要 |
PURPOSE:To contrive the improvement of a recognition rate by setting correction data against image pickup data at every split area where a variance is small, and executing the correction of the image pickup data at every split area. CONSTITUTION:Based on correction data determined at every split area of a pattern recognized area 11 of a semiconductor wafer 10, image pickup data from its split area is corrected. As for an illuminance, the variance is small in the split area, therefore, an appropriate correction is executed against data in the split area. Accordingly, even if there is the variance of the illuminance partially at the time of viewing the whole recognition area, the correction corresponding to its split area is executed at every split area. In such a manner, the recognition rate is improved. |
