| 摘要 |
<p>PURPOSE:To dispense with the island of a lead frame so as to reduce the lead frame in outer shape by a method wherein a semiconductor chip inserting recess is provided to the center of the lead frame, and a semiconductor chip is fixed to the ends of two or more leads which form the base of the recess. CONSTITUTION:A lead frame is rectangular in outer shape and provided with inner leads 3 which extend inward from its two opposed sides, and a rectangular recess 8 similar to the outer shape of a semiconductor chip 2 is provided in the center of the lead frame which includes the ends of the leads 3. The chip 2 is inserted into the recess 8 and fixed to the tip faces of the inner leads 3 through the intermediary of an insulating film 6 provided with a double-sided adhesive layer 7. The electrode pads of the chip 2 are connected to bonding sections 4 of the inner lead 3 through metal fine wires 5 respectively. By this constitution, a resin sealed type device small in outer shape and free from short circuit or disconnection of an inner wiring can be obtained.</p> |
