发明名称 RESIN-SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 PURPOSE:To increase the adhering surface area with silver paste and to increase the adhering strength of a mounting surface of a light emitting element by forming a plurality of grooves on the mounting surface of the light emitting element. CONSTITUTION:A mounting lead 1 having an element mounting surface 1, and a light emitting element 2 having a plurality of grooves 22 so formed that the depths thereof are shallower than those of a p-n junction 21 at the mounting surface side and a rear surface electrode 23 formed on the mounting surface are provided. Silver paste 3 of a conductive adhesive material for securing the light emitting element 2 by adhesively connecting the rear surface electrode 23 of the light emitting element 2 to the element mounting surface 11 of the lead 1, and epoxy resin 6 for covering to seal the other all part except the parts of the lead 1 and a lead 4 are provided. The coating amount of the paste 3 on the side face of the light emitting element 2 is reduced. Thus, it can prevent the paste 3 from being brought into contact with the p-n junction 21 to increase the adhering surface area, thereby enhancing its adhering strength.
申请公布号 JPH02154482(A) 申请公布日期 1990.06.13
申请号 JP19880309301 申请日期 1988.12.06
申请人 NEC CORP 发明人 KIMURA YOSHINARI
分类号 H01L21/52;H01L23/29;H01L23/31;H01L33/36;H01L33/56;H01L33/62 主分类号 H01L21/52
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