An electroplating apparatus for electroplating a plurality of items. The apparatus includes a tank having a bottom wall and side walls and adapted to hold a predetermined quantity of an electrolytic plating solution. A sparger system at the bottom of the tank directs the electrolytic plating solution in an upward direction. A cathode rack supporting the items to be electroplated extends intermediate to anode plates and upwardly from the sparger system. Strategically placed openings in the anodes and an anode screen in conjunction with the sparger system act to reduce the plating thickness variance over the rack.
