| 摘要 |
PURPOSE:To enable high-density filling by forming an organic titanium film on grains made of a mixture of copper powder and copper oxide powder, and scattering the grains for formation into a spherical shape. CONSTITUTION:An organic titanium film 4 is formed on grains 1A and 2A comprising a mixture of copper powder 1 and copper oxide powder 2, as shown in Fig. (a2). Furthermore, respective grains 1A and 2A are separated as shown in Fig. (a3) and formed into a spherical shape, thereby constituting a conductive material 6. This conductive material 6 is filled in the through-hole 12 of a green sheet 11. In addition, the sheet 11 filled with the conductive material 6 is baked and a multi-layer ceramic substrate 18 is thereby formed. Consequently, the conductive material 6 filled in the through-hole 12 is baked and a beard 7 is formed as shown in Fig. (c). According to the aforesaid construction, high- density filling can be done with the improvement of adhesion to the sheet 11. |
