发明名称 MANUFACTURING SYSTEM OF VERTICAL-TYPE SEMICONDUCTOR
摘要 <p>PURPOSE:To reduce a floor area and to easily install more systems by a method wherein a process chamber is installed in each stage position of a space positioned in an up-and-down direction and loading and unloading mechanisms of a wafer are installed on the front side of a plurality of process chambers arranged vertically. CONSTITUTION:A plurality of cassettes are installed in a cassette-housing chamber, provided with a load-lock mechanism, which is situated at a lowest stage of a cassette elevator 11; a cassette conveyance mechanism part is evacuated. Individual process chambers are evacuated in advance to a prescribed pressure by using individual pumps 3. When an evacuation operation of the cassette conveyance mechanism part is completed, one cassette is taken out from a cassette-housing box, conveyed, e.g., to a position in an uppermost stage by using the cassette elevator mechanism 11 and locked in this position. A wafer transfer robot 14 in each stage position takes out a wafer one by one from the cassette which has been locked in the position; the wafer 10 is set on a lower-part electrode 6 inside the process chamber; when a prescribed process is completed, the wafer is taken out and is housed in the cassette-housing chamber 13.</p>
申请公布号 JPH02152251(A) 申请公布日期 1990.06.12
申请号 JP19880305162 申请日期 1988.12.03
申请人 FURENDOTETSUKU KENKYUSHO:KK 发明人 TAKAGI MIKIO
分类号 H01L21/302;H01L21/205;H01L21/3065;H01L21/31;H01L21/677;H01L21/68 主分类号 H01L21/302
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