| 摘要 |
PURPOSE:To adjust a difference in level between the surface of a semiconductor chip and a substrate face to a thickness of a thin part by a method wherein the thin part is formed in at least two or more parts of the semiconductor chip and the thin part is fixed to the substrate face. CONSTITUTION:At a semiconductor chip 6a, a thick part 6e of the semiconductor chip 6a is inserted into a chip-positioning hole 2a made in a die bonding pad 2a of a lead frame 2; a thin part 6b is fixed to the die bonding pad 2a by using an adhesive 3. Al electrode terminals formed on the surface of the semiconductor chip 6a and outer leads 2b of the lead frame 2 are connected by using Au wires 4. This assembly is sealed by using a resin 5 for protective use; a semiconductor device is completed. |
