| 摘要 |
<p num="1"><br/><br/><br/><br/> Abstract Of the Disclosure<br/><br/> A thermal management system using heat pipe<br/>principles and incorporating capillary-pumped equipment<br/>mounting panels such that a heat transport loop without<br/>moving parts is provided. The panels can function to either<br/>absorb heat or to reject heat and can interface with heat<br/>generating equipment or heat radiators. Each panel comprises<br/>a pair of coextensive flat plates bonded together with a<br/>thin, fine-pore sheet wick interposed therebetween. A net-<br/>work of liquid grooves in one plate is in fluid communication<br/>with the sheet wick which covers the grooves and most of the<br/>plate and a separate liquid line connecting the panels. A<br/>network of vapor channels in the other plate is in fluid<br/>communication with the wick and with a separate vapor line<br/>connecting the panels. The vapor channel networks of the<br/>panels and the liquid groove networks of the panels are con-<br/>nected such that the panels are arranged in parallel in the<br/>fluid circuit or loop. A heat input into panels in the loop<br/>causes evaporation of liquid off the surface of the sheet<br/>wick. Vapor from the evaporated liquid is circulated to<br/>panels serving as cold sinks where the vapor is condensed.<br/>Capillary action of the wicks returns the condensate to the<br/>panels being heated where the cycle is repeated.<br/> |
