发明名称 DIE BONDING METHOD FOR OPTICAL SEMICONDUCTOR BARE CHIP
摘要 PURPOSE:To accurately regulate the position of a bare chip by providing protrusions at the side of a collet corresponding to markings provided on a metal pattern, irradiating the pattern with parallel light rays from the side of the protrusions, and regulating the relative position of the shade of the protrusions and the markings. CONSTITUTION:Four conical protrusions 30 are provided on the circumference at the side of a collet 10, and markings 28 are provided at the shade points of the ends of the protrusions 30 on a metal pattern 6 when an optical semiconductor bare chip 8 is disposed at a predetermined position on the pattern 6. The markings 28 are formed by providing recesses by hitting the pattern 6 made of Au-plating, etc. Thus, when the protrusions 30 and the markings 28 are provided to irradiate the pattern 6 with parallel light rays from the protrusions 30 when the chip 8 is regulated at the position of a brazing material, the shades of the protrusions 30 are formed on the pattern 6. Accordingly, the position of the collet 10 is so regulated that the shades of the ends of the protrusions 30 coincide with the markings 28. Thus, the chip 8 or the brazing material can be easily and accurately regulated at the position.
申请公布号 JPH02150041(A) 申请公布日期 1990.06.08
申请号 JP19880302254 申请日期 1988.12.01
申请人 FUJITSU LTD 发明人 HORIGOME NOBUYOSHI;OKAMOTO AKIRA;KIKUCHI EIJI
分类号 H01L21/52;H01L31/02;H01L33/62 主分类号 H01L21/52
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