| 摘要 |
PURPOSE:To obtain polymethylsilsesquioxane powder, excellent in water repellency and suitable as additives for preventing molding materials for sealing semiconductors from absorbing moisture by treating the surface of the powder with an organosilicon compound having a polyfluoroalkyl group linked to silicon atom. CONSTITUTION:The surface of polymethylsilsesquioxane powder is treated with a compound expressed by the formula {R<1> is polyfluoroalkyl [e.g. R<4>Q- (R<4> is 1-20C perfluoroalkyl; Q is 2-6C alkylene)]; R<2> is unsubstituted monofunctional hydrocarbon, preferably 1-4C alkyl; a is 1-3; b is 1 or 2; Z is H, halogen, OH, NR<3>X (R<3> is 1-4C alkyl; X is H or R<3>), etc., when b is 1 and 0, NX or S when b is 2}. The above-mentioned powder is preferably respectively independent and nearly spherical and contains >=80% particles having a particle diameter within the range of the average particle diameter + or -30% thereof. |
