| 摘要 |
<p>PURPOSE: To apply a highly uniform fastening pressure around the peripheral edge of a wafer, and to attain a uniform thermal contact with an electrode surface below by moving a ring fastening tool back and forth along a holding surface, aligning the ring fastening tool by engaging the first surface with a barrier, and holding the wafer at a prescribed position by engaging the second surface to the wafer. CONSTITUTION: A semiconductor wafer W is held by a reciprocatable ring fastening tool 80 to an electrode 32 of a plasma etching reaction device. The ring fastening tool 80 includes a first surface 86 which can be engaged with a rising circular barrier 88 and a second surface 84 for accepting the semiconductor wafer W, and holding it in a cavity 50. The contact of the first surface 86 of the ring fastening tool 80 with the rising circular barrier 88 guarantees the correct alignment of the ring fastening tool 80, so that a desired uniform pressure can be exerted anytime by the second surface 84 of the ring fastening tool. Normally, this ring fastening tool is elastically attached to a reciprocating mechanism, and the sufficient freedom of movement can be applied so that the correct alignment can be guaranteed.</p> |
