| 摘要 |
PURPOSE:To obtain a board for an electric circuit which is not peeled even if it undergoes a thermal heat cycle by heat treating copper alloy containing specific weights of Al and Be to form an alumina coating layer on an alumina whisker layer formed on the surface. CONSTITUTION:Copper alloy containing 0.2 - 12.0wt.% of Al and 0.01 - 20.0wt.% of Be is heat treated to form an alumina whisker layer 3 on a base metal 1 made of the copper alloy. Then, an alumina coating layer 2 is formed on the layer 3. Thus, a rigid close contact can be formed between the base metal and the coating layer, and a board for an electric circuit which is not peeled even if it undergoes a thermal heat cycle can be formed. |
