| 摘要 |
PURPOSE:To easily remove resin burr by removing a lead frame from a mold, and then injecting blast material to the frame in a punching burr direction. CONSTITUTION:A lead frame 1 is punched by a press, and the element 7 of an electronic component is connected. After the element 7 is connected, the frame 1 is placed and set at a predetermined position on the lower mold 9 of an injection mold 8 heated to 100-200 deg.C, and the sheath of the element 7 is formed of thermosetting resin 17. After the sheath is formed, the frame 1 is removed from the mold 8, the blast material is sprayed from the burr 5 side toward resin burr 6, and the burr 6 is removed. After the burr 6 is removed, the terminal 19 of the component 18 is soldered or tin-plated. |
