A capacitor is described for surface mounting in chip construction, which capacitor consists of a combination of a two-sided-metallised, temperature-resistant plastic film having mutually insulating rim and a non-metallised plastic film having low temperature resistance, interfering temperature influences on the core region of the capacitor being prevented by the fanned-out arrangement of the high-temperature-resistant and metallised foils in the region of the connection with the rear contact regions.
申请公布号
DE3839719(A1)
申请公布日期
1990.06.07
申请号
DE19883839719
申请日期
1988.11.24
申请人
ROEDERSTEIN SPEZIALFABRIKEN FUER BAUELEMENTE DER ELEKTRONIK UND KONDENSATOREN DER STARKSTROMTECHNIK GMBH, 8300 LANDSHUT, DE