| 摘要 |
PURPOSE:To make it possible to perform resin sealing characterized by excellent moisture resistance and breakdown strength by depositing a composition comprising the basic components of polyorganosiloxane having alkenyl group, organic peroxide and adhesive-property imparting agent at a specified composition ratio on the specified surface of an electronic component in a layered state, performing heat treatment, and obtaining an elastic hardened layer having surface tackiness. CONSTITUTION:The following basic components are prepared: 100 parts wt. of polyorganosiloxane having alkenyl group; 0.01-10 parts wt. of organic oxide; and 0.01-20 parts wt. of adhesive-property imparting agent. Composition formed by adding the following materials is prepared as required: 50 parts wt. or less of polyorganohydrogen-siloxane; and 20ppm or less of additive reaction catalyst. Said composition is deposited and formed on the specified surface of an electronic component to a thickness of, e.g. about 0.1-1mm in a layered state. The device is heated at temperature of about 100-200 deg.C for about 2-60 minutes. Said composition layer undergoes bridging reaction. The surface indicates tackiness, and the inside becomes an elastic hardened layer. Thereafter, e.g. urethane resin and the like for molding are applied or molded. |
