| 摘要 |
PURPOSE:To eliminate necessity of providing a type signal on each wafer and to prevent a malfunction caused by the type signal by forming semiconductor devices of different types to be manufactured in the same manufacturing steps at one semiconductor wafer. CONSTITUTION:A pattern Pa of first type A and a pattern Pb of second type B are integrally arranged and formed on a reticle 1 for contracting and transferring an element pattern on a wafer. In this case, the patterns Pa, Pb respectively include a plurality of element patterns. The reticle 1 is stepwisely aligned on the surface of a wafer 3 by a contraction projecting aligner to form elements Sa1, Sb1 of first and second types through predetermined steps. Thus, two types of different types of elements, i.e., semiconductor devices are simultaneously formed on one wafer 3. The devices of the different types A, B to be manufactured simultaneously are formed on the same wafer, thereby eliminating necessity of providing type signals for distinguishing the types on the respective wafers. |
