发明名称 SOLDER WIRE FOR MICRO SOLDERING
摘要 PURPOSE:To enable precise joining to fine parts corresponding to high density mounting and to prevent spattering of soldering and forming of bridge by arranging notching parts at perpendicular direction to longitudinal direction on surface of a wire in the fixed intervals. CONSTITUTION:As the necessary quantity of the solder (volume V) is regulated, the prescribed dimensional interval (pitch (l)) is decided with V=pi(D/2)<2>l to the wire 1 (diameter D). The notching parts 2 are arranged on the wire 1 with this pitch (l) and they are desirable to arrange at two position facing in the perpendicular direction to the longitudinal direction of the wire 1. The length W of the notching part 2 is decided with the depth (d) of the notching part 2 and the diameter of the wire 1. By this method, the precise joining to the fine parts can be executed, and the spattering of the solder and the forming of the bridge in case of the excess solder quantity can be prevented.
申请公布号 JPH02147197(A) 申请公布日期 1990.06.06
申请号 JP19880299248 申请日期 1988.11.26
申请人 SUMITOMO METAL MINING CO LTD 发明人 HIRAYAMA HIROSHI
分类号 B23K35/40;H01L21/52 主分类号 B23K35/40
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