| 摘要 |
PURPOSE:To achieve packaging without any bending failure or lifting failure of a lead by connecting and fixing the middle part of each lead piece by using an insulation material so that it cannot be deformed, performing bending- machining of it in a crank shape, attaching the tip part to an electrode part, and then separating from the connected and fixed part. CONSTITUTION:When mounting a lead terminal to a plurality of electrode parts 11a of a hybrid integrated circuit substrate 11, the middle part of each lead piece 12a is connected and fixed so that it cannot be deformed using an insulation material 13, and then middle part of each head piece 12a and the area between each lead piece 12a and the tip is subjected to bending-machining in a crank shape. Then, after attaching the tip part 12c of each lead piece 12a which is subjected to bending-machining to the corresponding electrode part 11a of the hybrid integrated circuit substrate 11, the mounted each lead piece 12a is separated from the above connected and fixed part 13. For example, a thermoplastic resin such a polyorefin, rubber, etc., are used as the above insulating material 13. If the rigidity is not sufficient, a filler may be used for hardening or glass, etc., may be used. |
