发明名称 Selective electroplating apparatus and method of using same
摘要 An electroplating apparatus for rapidly depositing a metal onto a selected surface of a workpiece, which apparatus comprises an anode having an active surface with a selected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about 0.050 inches, means for supporting this anode in a fixed position to define the elongated gap; solution circulating means for forcing an electroplating solution with metal cations through the gap in a generally closed path at a velocity to exchange electroplating solution in the gap at a rate of at least 25 times per minute; and, means for applying current flow between the selected workpiece surface and the active surface of the anode through the gap at a current density in excess of 2.0 amperes/in2. The invention also involves the method of using this apparatus to rapidly deposit metal, such as nickel, onto the inner cylindrical surface of a bore on a complex part such as an aircraft landing gear forging.
申请公布号 US4931150(A) 申请公布日期 1990.06.05
申请号 US19890348504 申请日期 1989.05.08
申请人 SIFCO INDUSTRIES, INC. 发明人 SMITH, GARY W.
分类号 C25D5/02;C25D5/08;C25D7/04 主分类号 C25D5/02
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