发明名称 ADHESIVE FOR COPPER FOIL FOR COPPER-CLAD LAMINATE
摘要 PURPOSE:To provide the subject adhesive using a prepreg impregnated with a phenolic resin, having excellent soldering heat-resistance and peel strength and composed of a composition containing a cresol novolak epoxy resin, etc., a phenoxy resin and dicyandiamide as a hardener. CONSTITUTION:The objective adhesive is composed of a composition produced by compounding a cresol novolak or alicyclic epoxy resin with a phenoxy resin, a dicyandiamide as a hardener and preferably further imidazole as a cure accelerator and a combination of imidazole and a urea-base accelerator as a urea- base accelerator.
申请公布号 JPH02145676(A) 申请公布日期 1990.06.05
申请号 JP19880299990 申请日期 1988.11.28
申请人 HITACHI CHEM CO LTD;HITACHI KASEI POLYMER KK 发明人 KOBAYASHI MAKOTO;YOKOTA MITSUO;ERIGUCHI HIDENORI
分类号 C08J5/24;B32B15/08;B32B15/092;C09J163/00;H05K3/38 主分类号 C08J5/24
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