发明名称 |
ADHESIVE FOR COPPER FOIL FOR COPPER-CLAD LAMINATE |
摘要 |
PURPOSE:To provide the subject adhesive using a prepreg impregnated with a phenolic resin, having excellent soldering heat-resistance and peel strength and composed of a composition containing a cresol novolak epoxy resin, etc., a phenoxy resin and dicyandiamide as a hardener. CONSTITUTION:The objective adhesive is composed of a composition produced by compounding a cresol novolak or alicyclic epoxy resin with a phenoxy resin, a dicyandiamide as a hardener and preferably further imidazole as a cure accelerator and a combination of imidazole and a urea-base accelerator as a urea- base accelerator. |
申请公布号 |
JPH02145676(A) |
申请公布日期 |
1990.06.05 |
申请号 |
JP19880299990 |
申请日期 |
1988.11.28 |
申请人 |
HITACHI CHEM CO LTD;HITACHI KASEI POLYMER KK |
发明人 |
KOBAYASHI MAKOTO;YOKOTA MITSUO;ERIGUCHI HIDENORI |
分类号 |
C08J5/24;B32B15/08;B32B15/092;C09J163/00;H05K3/38 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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