发明名称 |
Multilayer printed circuit board |
摘要 |
A multilayer printed circuit board comprises plural insulating layers integrated into one body, and internal wiring conductor layers located on the internal insulating layers, characterized in that conductor paths in each internal conductor layer are locally separated from the insulating layer by a cavity or porous layer provided at the boundaries between the path and insulating layer adjacent thereto. At least one insulating layer between internal conductor layers may be provided with a layered space or porous layer therein.
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申请公布号 |
US4931354(A) |
申请公布日期 |
1990.06.05 |
申请号 |
US19880265500 |
申请日期 |
1988.11.01 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
WAKINO, KIKUO;MANDAI, HARUFUMI |
分类号 |
H01L23/538;H01L23/64;H05K1/02;H05K1/03;H05K1/09;H05K3/46 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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