IC package positioning device in IC socket for IC carrier

摘要

An IC socket apparatus for receiving and positioning an IC package which has a plurality of IC leads projecting laterally therefrom and carried in an IC carrier. An IC socket has an IC package receiving recess therein and a plurality of peripherally shiftable contacts around the periphery of the recess for engaging and contacting leads of an IC package inserted into the recess. Guide elements guide an IC carrier onto the IC socket with an IC package guided into the recess. A guide member in the recess has a plurality of IC package guide portions extending upright from the front surface and spaced for engaging peripheral edge portions of an IC package and has a plurality of contact engaging grooves around the periphery at positions corresponding to positions of leads on an IC package relative to the guide portions and the contacts are engaged in the grooves. The guide member is movably positioned in the recess for movement laterally and rotationally in the recess.