| 摘要 |
PURPOSE:To achieve improved moisture resistance, prevent occurrence of resin crack, and allow a large semiconductor element to be mounted even if the package is thin and small by coating the semiconductor element with a first insulation resin film, providing a second insulation resin film, and then placing an internal lead on it. CONSTITUTION:An opening part 9a for exposing a pad part 2 of a semiconductor element 1, a first insulation resin 9 for coating the surface of the semiconductor element 1, a second insulation resin film 10 provided on the insulation resin film 9 at an area excluding the pad part 2, an internal lead 4 which is placed on the second insulation resin film 10, a sealing resin 6 for sealing the internal lead 4, the first and second insulation resin films 9 and 10, and the semiconductor element 1 are provided. For example, the surface of the semiconductor element 1 is coated with the polyimide resin coating film 9 which is the first insulation resin film, the polyimide resin film 10 which is the second insulation resin film is adhered and fixed on it, the internal lead 4 is adhered and fixed on the film 10, and connection is made by the Al pad 2 and an Au wire 3 of the semiconductor element 1. |
