发明名称 METHOD AND DEVICE FOR WIRE BONDING
摘要 PURPOSE:To make conditions of forming a ball by discharge constant without being affected by change of an entire length of an insulating coated wire in a simple structure by making a discharge voltage variable according to variations of a voltage drop due to change of a length from a tip section of the insulating coated wire to a base end section of a spool side. CONSTITUTION:Discharge is carried out between a tip section 13d of an insulating coated wire 13 which is wound to a spool 12 and drawn out from a bonding tool 10, and a ball 13e is formed by its discharge energy. The ball 13e is pressed and joined to a specified bonding section with the bonding tool 10. In such wire bonding method, a discharge voltage which is applied between the insulating coated wire 13 and the discharge electrode 15 is made variable according to variations of a voltage drop due to change of a length from the tip section 13d of said insulating coated wire 13 to a base end section 13c at the side of the spool 12. For example, said variations of a voltage drop is detected inside a discharge power source circuit 16 which generates said discharge voltage.
申请公布号 JPH02146741(A) 申请公布日期 1990.06.05
申请号 JP19880299934 申请日期 1988.11.28
申请人 HITACHI LTD;POWER:KK 发明人 AKIYAMA YUKIHARU;UENO MASAHIRO
分类号 H01L21/60 主分类号 H01L21/60
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