| 摘要 |
PURPOSE:To eliminate damage of a semiconductor chip, to improve yield and to acquire a highly reliable semiconductor device by providing a dummy pad to carry out wire cut thereon during wire bonding at an area near a semiconductor chip. CONSTITUTION:In a semiconductor device whereon a plurality of semiconductor chips 4a, 4b and an electrode terminal are bonded to an insulating substrate 2 and the semiconductor chips 4a, 4b are connected with a metal line 10 each other, a dummy pad 3e to carry out wire cut thereon during wire bonding is located at an area near the semiconductor chip 4b. And, for example, when the semiconductor chip 4a and the other semiconductor chip 4b are wire-bonded, the process is performed in order of; (1) bonding to the chip 4a, (2) bonding to the chip 4b, (3) bonding to the dummy pad 3e, and (4) wire cut on the dummy pad 3e. Since wire cut on a semiconductor chip is thereby eliminated, it becomes possible to eliminate damage of a chip, to improve yield, and to acquire a highly reliable semiconductor device. |
