Method for producing encapsulated semiconductor from improved epoxy resins

摘要

An epoxy resin composition comprising a novolak type epoxy resin which is produced from a substituted-phenol novolak and epihalohydrin, and is 0.15 or less in a maximum absorbance of a 3% (W/V) dichloromethane solution of the epoxy resin, the absorbance being measured at a wave number of between 3570 and 3600 cm-1 with an infrared spectrophotometer having a cell of 2 mm length, which is useful particularly in encapsulating and laminating applications in electronic fields.