WIRING SUBSTRATE FOR MINIATURE MODULE,申请号JP19880296113-传众专利搜索

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发明名称	WIRING SUBSTRATE FOR MINIATURE MODULE
摘要
申请公布号	JPH02143582(A)	申请公布日期	1990.06.01
申请号	JP19880296113	申请日期	1988.11.25
申请人	NEC CORP	发明人	TAKETOMI TAKESHI
分类号	H05K1/02;H05K1/14;H05K3/36	主分类号	H05K1/02
代理机构		代理人
主权项
地址

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