| 摘要 |
PURPOSE:To augment the bonding strength of a metallic wiring onto an interlayer insulating film as well as the counter strength of an outer connecting electrode against external force thereby enhancing the reliability of an electrode by a method wherein the bonding strength between the metallic wiring and the underneath interlayer insulating film is augmented by eliminating a barrier layer from an electrode leading out part. CONSTITUTION:A metallic wiring 8 is provided on a PSG 7 while one end of the metallic wiring 8 is connected to a diffused layer 3 via a through hole 7a formed in the PSG film 7 and a CVD film 6. On the other hand, a rectangular electrode leading-out part 9a is formed on the other end of the wiring 8. A final passivation film 9 is formed on the metallic wiring 8 while the electrode leading-out part 8a is externally exposed from another through hole 8a made in the passivation film 9. In such a constitution, the metallic wiring 8 is composed of an Al-Si alloy while a barrier layer 12 is partially laid down underneath the metallic wiring 8. That is, the barrier layer 12 is provided on the contact part of the said N<+> diffused layer 3 and the peripheral part thereof but not provided underneath the electrode leading-out part 8a. |
