发明名称 METHOD AND APPARATUS FOR RESIN SEALING MOLD OF ELECTRONIC PARTS
摘要 PURPOSE:To enable a high quality and high reliability resin sealing molding to be manufactured with high efficiency by applying required vibration to a plunger during the time of pressurizing period of a resin material by the plunger, and applying a required vibration effect to be resin material via the plunger. CONSTITUTION:A lead frame mounted with electronic parts is set on a predetermined position in the P.L surface of a lower mold 2, and resin materials R are supplied respectively into the each spot 3 of the lower mold 2, and the mold clamping of both upper and lower molds is conducted then. At this time, a load meter 18, vibrator 10, disengaging member 9, plunger holder 7 and respective plungers 4 move upward simultaneously. And, in the time of resin sealing mold, the vibrator 10 is actuated at least when each plunger 4 pressurizing respectively the resin materials R within the each spot 3 moves upward, and each of plungers 4 receives a predetermined vibration via the plunger holder 7.
申请公布号 JPH02141217(A) 申请公布日期 1990.05.30
申请号 JP19880295528 申请日期 1988.11.21
申请人 T & K INTERNATL KENKYUSHO:KK 发明人 OSADA MICHIO
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/58;B29L31/34;H01L21/56 主分类号 B29C45/02
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