| 摘要 |
An apparatus for and a method of controlled feed of a bonding wire, specifically a golden bonding wire, to the wedge or the capillary tube of a bonding head arranged for upward and downward movement. The apparatus is characterized by a bonding-wire guide duct ahead of the bonding capillary tube, with a fluid pipe opening into this duct which is suited for optional communication with a source of gas blast, specifically air blast, or a vacuum source, and is preferably also characterized by a bonding-wire slip clamp which is effective or closed either permanently or only when the bonding head is lowered for touch-down, and which is disposed particularly ahead of or at the capillary-facing end of the guide duct. Moreover, a stationary bonding-wire clamp may join the bonding-wire guide duct which, depending on the level of the bonding head, may be closed or opened while retracting and correspondingly severing a bonding wire section that may project downwardly from the capillary tube tip, immediately before the second touch-down.
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