| 摘要 |
A terminal assembly for an integrated semiconductor circuit includes a semiconductor chip in the semiconductor circuit having a surface, end faces, an electrically active chip surface regions of the surface adjacent the end faces, electric circuits of the semiconductor chip within the electrically active chip surface defining at least one given area of the surface within the electrically active chip surface being free of electric circuits, contact pads disposed in the regions of the surface adjacent the end faces for electrically connecting the semiconductor circuit to electrical signals and/or potentials, and other contact pads disposed in the at least one given area between the regions of the surface adjacent the end faces for electrical connection to at least some of the electrical signals and/or potentials.
|
