| 摘要 |
<p>PURPOSE:To perform bonding easily with accuracy by the use of a wire between a semiconductor element and each inner end part of a lead by causing a stepped part to be formed outside the region for sealing of a suspended lead with resin so that an element loading part is located at a position lower than the inner end part. CONSTITUTION:A plurality ot leads 42 are disposed near an element loading part 41 of a lead frame 40 and each lead has inner and outer end parts 42a and 42b and respective leads 42 are coupled and supported by a tiebar 43-1 which is fixed to a frame part 44. As the element loading part 41 is spaced at a prescribed interval (h) 2 from the inner end part 42a and is located at a position lower than the above inner end part, a stepped part 45a is formed at a suspended lead 45 that is outside the region of resin-sealing and accordingly, the stepped part 43-2a is formed even at a tiebar 43-2. Since the stepped part 45a of the suspended lead 45 is formed outside the region of resin-sealing, such a large stepped part 45a is formed in this way and its formation of the stepped part makes it possible to prevent an edge short circuit which takes place between a wire 53 and a semiconductor element 50 and further, it makes the wire 53 longer. Connection work is thus performed easily with accuracy.</p> |
