| 摘要 |
PURPOSE:To efficiently manufacture various kinds of integrated circuits in a small quantity by a method wherein a substrate forming process common to all kinds of integrated circuits is executed at the same time using a ribbon-like substrate, and an assembly process is exclusively performed by each kind of integrated circuits. CONSTITUTION:Substrates A, A', A'' of the same size are arranged in a broadwise direction of a substrate on partitions, determined by first index holes 12, of individual integrated circuit substrates 13 shown by dotted lines on a ribbon-like board 11. Another kind of substrates B of the same kind are arranged in next partitions determined by index holes 12 with a different space. Substrates C of the same kind follow the same as above. Next, a conductive pattern 15 is formed on the partitions 14 respectively, and an individual identification code 16 corresponding to the pattern 15 is printed. Then, a resistive element is formed. The substrates 13 are separated from the substrate 11. Next, the separated substrates 13 are selected by the same kind of substrate such as A, A', and A'', B, or C provided with the same pattern 15 according to the code 16, and then the selected substrates 13 are sent to an exclusive assembly process respectively. By this setup, various kinds of integrated circuit substrates can be manufactured in a small quantity taking advantage of the merit of a mass production. |
