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发明名称
PACKAGE STRUCTURE OF ELECTRONIC COMPONENT
摘要
申请公布号
JPH02138766(A)
申请公布日期
1990.05.28
申请号
JP19880196881
申请日期
1988.08.06
申请人
MITSUBISHI ELECTRIC CORP
发明人
KASATANI TAIJI
分类号
H01L23/50;H05K1/18;H05K3/34
主分类号
H01L23/50
代理机构
代理人
主权项
地址
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