发明名称 PRINTED WIRING BOARD
摘要 PURPOSE:To easily manufacture the title board and to sharply enhance a positional accuracy of a circuit by a method wherein a conductor circuit member and an insulating sheet are fit, they are pasted on a base sheet and a circuit layer is formed. CONSTITUTION:A glass epoxy sheet and a copper sheet are stamped; a circuit member 3 of a prescribed shape and an insulating sheet 4 having a hole, in a prescribed position, of a shape corresponding to the circuit member 3 are manufactured. The circuit member 3 and the insulating sheet 4 are fit; a circuit layer 10 is formed; this is pressure-bonded thermally, by using a vacuum press, to a base sheet 1 composed of a glass epoxy sheet via a glass epoxy prepreg; a printed wiring board is obtained. Thereby, it is possible to obtain the printed wiring board which can be manufactured easily and whose positional accuracy of a circuit is high.
申请公布号 JPH02137392(A) 申请公布日期 1990.05.25
申请号 JP19880290221 申请日期 1988.11.18
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 JINBO MUNEMASA;KANEKO MINEO;AKIMOTO MITSURU;KONISHI SHINICHI
分类号 H05K3/20;H05K3/44 主分类号 H05K3/20
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