| 摘要 |
<p>PURPOSE:To prevent the corrosion of a semiconductor chip caused by moisture by providing on inflection part wherein a part except an inner chip protrudes in the direction vertical to a surface containing an island. CONSTITUTION:On the peripheral of an island 7 of a surface containing the island 7, an inner lead 3 is arranged, while an inflection part 2 where a part except the tip of the inner lead 3 protrudes in the direction vertical to a surface containing an island 7 is installed. A semiconductor chip 4 mounted on the island 7, electrodes of the semiconductor chip 4 and the tip of the inner lead 3 are electrically connected by bonding wire 5. The island 7 and the inner lead 3 are sealed with a resin body 6. An outer lead 1 is connected with the inner lead 3, and led out toward the outside of the resin body 6. Thereby, the corrosion of a pad caused by moisture is prevented, and the reliability can be improved.</p> |
