发明名称 MANUFACTURE OF SINTERED MOLYBDENUM CHIP FOR DIODE
摘要 PURPOSE:To easily and surely remove remaining fine oxide by polishing a molybdenum chip with fine abrasive made of oxide and then pickling to immerse it in dilute acid solution. CONSTITUTION:Sintered molybdenum for a diode in which its surface is barrel- polished with fine abrasive made of oxide such as aluminum trioxide, etc., is immersed in dilute acid solution mixed with hydrochloric acid and nitric acid to be pickled. Then, in order to remove an oxide film layer formed by the pickling, it is washed with pure water stream, and then annealed in a reduced gas atmosphere such as hydrogen gas, etc. In order to smooth its surface, a finish-barrel step (gloss-polishing step) is conducted. Thus, the remaining fine oxide can be easily and surely removed.
申请公布号 JPH02137320(A) 申请公布日期 1990.05.25
申请号 JP19880290257 申请日期 1988.11.18
申请人 TOKYO TUNGSTEN CO LTD 发明人 AKECHI HIDEAKI
分类号 H01L21/52;H01L21/304 主分类号 H01L21/52
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