| 摘要 |
<p>PURPOSE:To eliminate a drop in a yield by a breakage, a crack and the like by a method wherein an adhesive tape is stripped off by sucking it from the rear surface of a semiconductor pellet without a need to push up a pushing-up pin. CONSTITUTION:A tape at the outside of a semiconductor pellet is supported by a cylindrical holder; then, an arm 6 sucks the semiconductor pellet 1; after that, a suction port at the inside of the holder 3 sucks an adhesive tape 2; the adhesive tape 2 is stripped off from the rear surface of the semiconductor pellet 1. Then, the pellet is lifted and picked up by using the arm 6. Thereby, it is possible to surely peel off the adhesive tape 2 from the semiconductor pellet 1 and to eliminate a drop in a yield.</p> |
