| 摘要 |
PURPOSE:To improve heat dissipation of a semiconductor element by bringing a bump into contact with the predetermined position of a conductor pattern or a semiconductor element, and adhering the opening end of a sealing cap covering the element to a substrate with adhesive having high shrinkage. CONSTITUTION:A bump 4 is made to abut on a predetermined position of a conductor pattern 2 or a semiconductor element 3, and the opening end of a sealing cap 6 covering the element 3 is adhered to a substrate 1 with adhesive 9 having high shrinkage. Accordingly, the element 3 is brought into pressure contact with the board 1 by shrinkage force at the time of curing of the adhesive 9 to obtain electric contacts among the element 3, the bump 4 and the pattern 3, and the element 3 is brought into pressure contact with the cap 6. Thus, the heat dissipation of the gang bonded element 3 can be improved without necessity of mounting a heat sink plate, etc. |
